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Data-Intensive Payload Processor


Data-Intensive Payload Processor

ODALISS DIPP is a compact embedded computer designed to offer the highest computational performance for the most challenging applications.

The ODALISS DIPP, based on dual–core ARM® + FPGA fabric, increases the computational capability of the satellite allowing easy integration of high-level software, as Python scripts, running over Linux OS.

Main Features:

  • Versatile architecture based on Xilinx® Zynq®-7000 SoC, supporting flexible software configuration namely multiprocessing capabilities on Linux along with low-level software, like bare-metal drivers or RTOS.
  • Ethernet connection capable of meet the highest data processing requirements for data intensive payloads, such as Earth observation cameras, Software-Defined Radios (SDR), scientific instruments, etc.
  • PGA fabric can be reconfigured in Run-Time by processor to increase the digital processing capability of the system.
  • Rich set of communication peripherals, including Ethernet, UARTs, RS-485, I2C, USB ports along with GPIOs.
  • Connectors
    • 80-pins high-speed interface backplane connector.
    • 10-pin Pogo-style for program and debug without mechanical stress.
    • 10-pin Pogo-style for NAND flash data access.
  • Memory
    • eMMC NAND flash or microSD card configurable from 4GB up to 256GB.
    • 1GB or 512GB DDR3L RAM.
  • High-speed connectivity
    • 10/100Mbps capacitive-coupled Ethernet connection.
    • USB Port.
  • Standard Logic Interfaces
    • Three CMOS-level UARTS. RS-485.
    • USB port.
  • Processing capabilities
    • Xilinx® Zynq®-7000 SoC. Dual 667MHz 32-bit ARM® Cortex®-A9 and 28nm Xilinx® programmable logic.
    • Single processor, symmetric dual processor, and asymmetric dual processor modes.
    • FPGA with logic cell size selectable between 28k to 85k logic elements with possibility to be reconfigured in Run-Time.
  • Power-supply
    • Redundant power-supply directly from 2S lithium-based battery.
    • Overcurrent, overvoltage, undervoltage and reverse connection protections.
    • Power-supply shut-down and fault signals.
  • Payload control
    • Six Open-drain GP logic inputs.
    • Six open-drain GP logic outputs.
  • Integration
    • Operating temperature: -45 ºC to +85 ºC.
    • Size: 87mm x 87mm x 10mm.
    • Weight: 60 grams
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